CoreFlow
Advanced Substrate Handling Solutions
Company Overview
Snapshot
Founded in June 1999, CoreFlow operates with 11–50 employees. The company has raised $3.2M across one funding round from two investors. In September 2024, CoreFlow launched the GripJet vacuum stage for flattening and handling warped panels in the panel-level packaging manufacturing process.
Business overview
CoreFlow specializes in airflow management solutions designed for the precise handling and transportation of delicate materials within the semiconductor and electronics industries. The company's core technology utilizes a non-contact, vacuum-based system to safely move fragile materials like glass and thin wafers, mitigating damage and contamination risks inherent in traditional handling methods. This technology aims to enhance production yields, reduce product loss, and improve overall product quality for markets requiring advanced material handling.
Strategic signal
In December 2025, CoreFlow unveiled a new 310 mm vacuum stage specifically engineered to address significant warpage challenges in CoWoS panel-level packaging. This development signals CoreFlow's continued innovation in solving critical manufacturing hurdles for the semiconductor industry, demonstrating its capability to provide high-accuracy aerodynamic handling solutions that can improve production efficiency and product integrity for advanced packaging technologies.
Company Intelligence Q&A
- What is CoreFlow's primary focus?
- CoreFlow specializes in advanced airflow management solutions for handling and transporting delicate materials in the semiconductor and electronics industries, focusing on minimizing damage and contamination.
- When was CoreFlow founded?
- CoreFlow was founded in June 1999.
- What was a key product launch by CoreFlow in September 2024?
- In September 2024, CoreFlow launched the GripJet vacuum stage, designed for flattening and handling warped panels in the panel-level packaging (PLP) manufacturing process.
- What new technology did CoreFlow unveil in December 2025?
- In December 2025, CoreFlow unveiled a new 310 mm vacuum stage to solve major warpage challenges in CoWoS panel-level packaging, enhancing its offerings for the semiconductor industry.
- How much capital has CoreFlow raised?
- CoreFlow has raised $3.2M across one funding round.